ficonTEC provides automated micro-assembly and testing solutions for the photonics industry. These solutions are realized as cutting-edge, semi- or fully-automated production systems, regardless of the device material and of the specific application the device is targeting. Our modular system architecture is additionally scalable, so that exploratory, proof-of-process assembly as well as high-volume assembly and test requirements are addressable – and anything in between.A globally installed base of over 700 systems is already serving integrated photonics applications in telecom and datacom sectors, in sensing applications ranging from biomedical to automotive, in high-power diode laser assembly, and much more.Not resting with the status quo, ficonTEC is continually and actively involved in several internationally-supported initiatives. These initiatives promote access to integrated photonics technology through the current transition to high-volume manufacturing processes via advanced automation – regardless of whether for singulated dies or for wafer-level approaches.