Job Description
1. Provide tactical support to planning team on assembly yield issues affecting shipments and delivery
-Supports closure of line disturbance, low yield lots and maverick issues (disposition, analysis and corrective action)
-Coordinates with PE and Fab team or Quality on wafer or product related issues
2. Drives subcontractor performance KPI (yield, line disturbances, OEE …)
3. Be part of New Product Ramp team and manages safe launch
-Drive new subcontractor enabling (Technical & Supply Chain)
4. Supports technical capability assessments in subcontractor
-Keep track of subcontractor capability in terms of process, equipment and package portfolio
5. Manage/Coordinate Change Management at subcontractor
-Cost reduction projects,
-Changes in material and process at subcontractor
6. Drives best practice sharing and benchmarking activities at subcontractor
7. Manages assembly documentation (control plan, OCAP, …)
-Reviews and Updates Control Plan and Assembly procedures to align to Infineon requirements
-Handles Deployment of Infineon initiated assembly procedures and systems
-Review and approve pre-assembly documentation (eg: Asssembly Specification/Business Development/Marking Instruction)
8. Supports FAR activities including analysis of rootcause and improvement action in subcontractor
9. Participate in Infineon design/change reviews (TR and PCRs) and provide inputs on key learnings / improvements to incorporate on new products
10. Supports VDA and customer audit activities in subcontractor

Job Requirement
1.Functional Knowledge
-Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical) or equivalent
-5 years of process (assembly & test) and project management experience or above, experience in subcontractor management
-Good process, assembly engineering knowledge, basic test process and product engineering know-how
-Good understanding of quality requirements (e.g. 8D, MRB process, 9-steps quality plan, qualification release criteria, change management), good understanding on operation/ planning/ logistics
2.Business Expertise
-Knowledge of internal interdependencies (organisation, work flow, customers, suppliers)
-Good understanding of assembly package and assembly operations
-Good knowledge of workflow/ project management systematics
-Knowledge of business line interfaces (e.g business unit, quality, purchasing, supply planning)
-Knowledge of operation interfaces (e.g development, product engineering, quality management)
-Knowledge of external environment (market, competitors, products, industries)
-Minimum exposure as direct interface with material supplier
-Degree of knowledge of other relevant organisations (legal, governmental, professional organisations)
3.Leadership
-Extent of people management responsibility (allocation of work, training, mentoring, development, budget)
-Extent of technical leadership (training, technical development of team)
-Project management (size of teams, size of budget, complexity of projects)

英飞凌中国荣登2016年“大中华区最佳职场”前30强榜单。

英飞凌科技股份有限公司总部位于德国纽必堡，致力于为现代社会的三大科技挑战领域-高能效、移动性和安全性提供先进的半导体产品与系统解决方案。2016财年(截止到2016年9月30日), 英飞凌销售额达64亿欧元。英飞凌在法兰克福证券交易所（股票代码：IFX）和美国柜台交易市场 OTCQX International Premier（股票代码：IFNNY）挂牌上市。

英飞凌在中国建立了涵盖研发、生产、销售市场、技术支持等在内的完整的产业链。在研发方面，英飞凌在上海、北京建立了应用研发中心，利用国内的人才资源，参与全球的重点项目研究；在无锡的后道生产工厂，为中国及全球其他市场生产先进的芯片产品；在北京的子公司主要从事IGBT组件的生产；并以北京、上海、深圳和香港为中心在国内建立了全面的销售网络。同时，我们在销售、技术研发、人才培养等方面与国内领先的企业、高等院校开展了深入的合作。

随着英飞凌的业务在中国的迅速增长，我们诚邀您的加入与我们共同迎接挑战，见证英飞凌的成长。

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